As artificial intelligence (AI) continues to advance, the demand for high-performance data centers is growing rapidly. To explore the challenges and innovations in cooling AI data centers, I, spoke with Mr. Yunshui Chen, CEO and founder of AirSys. The company specializes in cutting-edge cooling solutions for the ICT industry, addressing the impact of AI on data center operations and the need for cooling at higher rack densities.
AirSys initially focused on cooling solutions for the telecom sector but soon expanded into data centers as AI’s influence grew. Recognizing the challenges of density and energy efficiency, Mr. Chen emphasizes that while density is an issue, the real challenge lies in finding sustainable energy solutions.
I asked Mr Chen how AirSys tackles these challenges with the innovative liquid cooling technology they have developed which not only addresses density but also recovers wasted heat for reuse, driving the company and their partners towards a more “sustainable” future.
Energy-Efficient Solutions for the Future
“We differentiate ourselves by focusing on the reuse of recovered heat. Our absorption chillers operate at higher temperatures and transform waste heat into a cooling source, thus maximizing energy efficiency within data centers” said Chen.
“One of our key strengths is the product scalability and adaptability to the fast-evolving AI infrastructure landscape – By seamlessly integrating with existing data center setups and offering a hybrid cooling approach, we envision a future dominated by liquid cooling, supported by sustainable energy practices”.
Embracing Liquid Cooling
The environmental advantages of liquid cooling over traditional air cooling are clear. “AirSys plays a significant role in reducing carbon emissions and overall energy consumption, helping data center operators improve efficiency. As operators focus on sustainability and the industry shifts toward liquid cooling, this places us at the forefront of the sustainable transformation of data centers and digital infrastructure, supporting the next generation of “AI facilities” being designed and built”.
With AirSys focus on flexibility and adaptability, its solutions are able to meet the evolving heat profiles of emerging AI chips, providing customized cooling solutions for specific chip requirements ensuring, data center operators can handle the demands of next-generation technologies.
Partnering with AirSys for AI-Powered Data Centers
As AI continues to expand, the need for advanced cooling solutions becomes even more pressing. Mr Chen adds “we are ready and prepared to collaborate with operators who are building these new AI data centers, we can provide them with live demonstrations in our state-of-the-art lab to demonstrate the performance of our liquid cooling technology”.
In conclusion, Mr. Chen highlighted the critical importance of advanced cooling systems in the AI Era. Their approach to harnessing heat for sustainable energy and improving energy efficiency demonstrates their commitment to revolutionizing data center cooling practices.
As the industry evolves to meet the extraordinary demands AI presents, solution providers like AirSys will be critical in managing the increased rack densities that AI will bring, paving the way for data centers to deliver both social and economic value.
