Khazna Data Centers and Siemens have signed a Memorandum of Understanding to examine technologies aimed at the next generation of AI data center infrastructure. The agreement, signed at the UAE-Germany Business Forum in Munich, creates a framework for cooperation spanning AI-ready infrastructure strategy, digital twins, next-generation power architectures, technology testing and Emirati engineering talent development. The partnership comes as AI workloads push data center operators toward higher compute densities, larger power requirements and more complex infrastructure systems. Rather than focusing on a single technology, the companies plan to examine how digital, electrical and operational systems can work together across future facilities.

Khazna and Siemens Target AI Infrastructure Complexity

The companies will explore emerging technology trends and assess how they could influence the design and operation of future data centers. A central element involves digital twin technology, which can help operators model infrastructure environments, validate designs and examine system performance before and during deployment. Siemens brings digital twin capabilities covering simulation, design validation, system integration, commissioning and operational optimization for data center infrastructure. Meanwhile, Khazna contributes experience developing and operating large-scale data center infrastructure as it expands its international footprint.

“Siemens has made important contributions to the technologies that help data center operators manage critical infrastructure efficiently and reliably. That becomes even more important as AI drives significantly denser computing environments and places new demands on power and supporting systems,” said Sultan Alowais, Vice President – International Execution at Khazna Data Centers. “Through this MoU, we want to combine that technology expertise with the operational and delivery experience we have built at Khazna, looking practically at what the next generation of AI infrastructure will require and how we can prepare for it.”

800 VDC Architecture Enters the Discussion

Power architecture forms another major component of the agreement, with both companies continuing to progress next-generation 800 VDC power architectures and their potential use in AI data centers. Higher-density AI systems create tighter relationships between computing equipment, electrical distribution, power conversion and thermal management. The companies intend to use their technical collaboration to examine those relationships through technology testing and practical infrastructure applications. However, that approach places power delivery within the broader engineering question of how future AI facilities can accommodate growing loads without allowing electrical complexity to constrain deployment.

“AI is fundamentally changing the requirements placed on data center infrastructure. Higher compute densities, rapidly growing power demand and increasing system complexity require new approaches to how facilities are designed, powered, and operated,” said Helmut von Struve, Chief Executive Officer of Siemens Middle East and UAE. “By combining Siemens’ expertise in electrification, automation and digitalization with Khazna’s experience developing and operating large-scale data center infrastructure, we can explore and validate technologies in real-world environments. This collaboration is about turning emerging technologies into practical infrastructure solutions that can support the scale, resilience, and efficiency the next generation of AI data centers will demand.”

Emirati Engineers Become Part of the Plan

The MoU also extends beyond infrastructure technology into engineering talent development. Siemens will sponsor internships in Germany for nominated Emirati engineers under the proposed initiative, giving participants exposure to next-generation technologies, engineering practices and data center applications. The program links technical development with the broader infrastructure ambitions of the partnership, creating a pathway for engineers to gain experience across advanced systems and operating environments. The companies also plan to examine opportunities for broader international cooperation as Khazna expands its portfolio.

The international dimension could allow Siemens technologies to move from evaluation into potential applications across Khazna’s growing global infrastructure base. The companies have not announced specific deployments or commercial commitments under the MoU, keeping the agreement focused on technical exploration, validation and capability development. As AI infrastructure evolves, the partnership positions digital modeling, power architecture and engineering expertise as interconnected parts of the facility-development equation. Consequently, the outcome will depend on how successfully the companies translate those areas of cooperation into technologies and operating practices that can perform under real-world AI workloads.